MIRTEK AOI MV6 Series
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MIRTEC MV-6 Series – Advanced Full 3D Inline Automated Optical Inspection System
Technical Specifications
Advanced full 3D inspection technology engineered for accurate PCB defect detection and reliable SMT production.
| Technical Parameters | MV-6e OMNI | MV-6em OMNI | MV-6DL OMNI |
|---|---|---|---|
| PCB Specifications | |||
| Maximum PCB Size Range | 50 × 50 – 510 × 460 mm | 50 × 50 – 330 × 280 mm |
50 × 50 – 490 × 300 mm (Double Lane) 50 × 50 – 490 × 590 mm (Single Lane) |
| OMNI-VISION® 3D / 2D Inspection Technology | |||
| 3D Inspection Technology | Digital 8 Projection Moiré Technology | ||
| Height Accuracy | ±3 μm | ||
| 3D / 2D Maximum Inspection Speed | |||
| 25MP Camera – 7.7 μm (CXP) | 1,460 mm²/sec | ||
| 15MP Camera – 15 μm (CXP) | 4,260 mm²/sec | ||
| 15MP Camera – 10 μm (CXP) | 1,890 mm²/sec | ||
| 2D Maximum Inspection Speed | |||
| 25MP Camera – 7.7 μm (CXP) | 4,593 mm²/sec | ||
| 15MP Camera – 15 μm (CXP) | 10,716 mm²/sec | ||
| 15MP Camera – 10 μm (CXP) | 5,080 mm²/sec | ||
| System Specifications | |||
| Lighting System | 8 Phase Coaxial Colour Lighting System | ||
| Side Camera System (Optional) | 18 / 10 Megapixel Digital Colour Side Cameras (4 Cameras) | ||
| Software – Standard | Built-in SPC, Built-in Repair, RDS | ||
| Software – Optional | RRS, IRS, OLTT, SPC Server System, ePM-AOI | ||
| PCB Top Side Clearance | 45 mm | ||
| PCB Bottom Side Clearance | 50 mm | ||
| PCB Thickness – Standard | 0.5 – 3 mm | ||
| PCB Thickness – Optional | 0.5 – 5 mm | ||
| Maximum PCB Weight | 4 kg | ||
| Minimum Measurement Size – 7.7 μm | 03015 Chip (mm) / 0.3 Pitch (mm) | ||
| Minimum Measurement Size – 15 μm | 0603 Chip (mm) / 0201 Chip (inch) / 0.4 Pitch (mm) | ||
| Minimum Measurement Size – 10 μm | 03015 Chip (mm) / 0.3 Pitch (mm) | ||
| Motion & Positioning System | |||
| Robot Positioning System | Servo Motor System (X / Y Axis) | ||
| Power & Utility Requirements | |||
| Power Requirements | Single Phase, 200–240V, 50–60Hz, 1.1 kW | ||
| Air Requirements | 5 kgf/cm² (0.5 MPa) | ||
| Dimensions & Weight | |||
| Machine Dimensions (W × D × H) | 1,080 × 1,470 × 1,560 mm | 900 × 1,290 × 1,560 mm | 1,080 × 1,610 × 1,560 mm |
| Machine Weight | Approx. 950 kg | Approx. 870 kg | Approx. 1,010 kg |
Key Features
Innovative optical inspection and measurement technologies designed to improve accuracy, production quality and operational efficiency.
25MP High-Resolution Camera
Equipped with a 25-megapixel top camera and 7.7 μm resolution to capture fine PCB details and support inspection of miniature 03015 components.
Digital 8 Projection Moiré Technology
Uses eight digital projection patterns and four-direction measurement to reconstruct detailed 3D images and minimise inspection blind spots.
Precise 3D Measurement
Advanced Moiré projection technology measures component height and surface variations with an accuracy of ±3 μm for dependable defect detection.
8-Phase Coaxial Colour Lighting
Combines eight lighting conditions to produce clear, low-noise images and improve inspection of chip leads, solder joints and other fine details.
18MP Side Viewer® Cameras
Four optional high-resolution side cameras inspect components from multiple directions, supporting detailed J-lead and QFN component inspection.
High-Speed CoaXPress Vision System
High-performance CoaXPress image transmission supports faster data transfer and improved inspection processing for demanding SMT production lines.
Intellisys® System
Provides remote monitoring, SPC analysis, debugging and repair support to help identify inspection issues and reduce production-related losses.
Space-Saving Slim Design
The MV-6em OMNI features a compact 900 mm machine width, helping optimise production floor space while maintaining advanced inspection capabilities.
Industries we serve
Our Automated Optical Inspection (AOI) solutions support a wide range of electronics manufacturing industries by delivering intelligent defect detection, enhanced quality assurance, and reliable inspection throughout the SMT production process.
