AI-Powered Solder Paste Inspection (SPI)

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Intelligent SPI System for Accurate Solder Paste Inspection & Process Control

The Solder Paste Inspection (SPI) system is designed to verify solder paste quality with exceptional precision before component placement, helping manufacturers achieve reliable SMT assembly and minimize production defects. Using advanced 3D measurement technology, AI-driven inspection, and high-resolution imaging, it accurately analyzes solder paste volume, height, area, and alignment on every PCB.

Engineered for high-speed SMT production lines, the SPI system provides real-time process monitoring, detects printing defects at an early stage, and ensures consistent solder paste deposition across every board. Its intelligent automation, fast inspection speed, and seamless line integration make it an ideal solution for improving first-pass yield, reducing rework, and maintaining superior manufacturing quality.

TECHNICAL SPECIFICATIONS

Machine Specifications

Designed for high-speed solder paste inspection with advanced AI, true 3D optical measurement, and seamless SMT production integration.

Machine Type Solder Paste Inspection (SPI)
Inspection Technology AI-Based True 3D Optical Inspection
Camera Resolution 25 MP High-Speed Camera
Height Resolution 2 ฮผm
Inspection Speed 0.6 sec / Field of View
Maximum PCB Size 560 ร— 550 mm
Minimum PCB Size 50 ร— 50 mm
PCB Thickness 0.5 โ€“ 5 mm
Maximum PCB Weight 5 kg
Measured Parameters Volume, Height, Area & Offset
Lighting System Structured RGBW LED Lighting
Operating System Windows 11
Data Processing 40 Gbit/sec
Machine Weight Approx. 1170 kg
KEY FEATURES

Advanced 3D Solder Paste Inspection for Superior Print Quality

The SPI system combines AI-powered analytics, true 3D measurement, and high-speed inspection to verify solder paste quality before component placement, ensuring consistent printing performance and improved SMT yield.

True 3D Inspection

Accurately measures solder paste height, volume, and area for reliable process verification.

AI-Powered Analysis

Intelligent algorithms identify printing defects while reducing false calls.

High-Resolution Imaging

Captures detailed solder paste images for precise inspection and quality control.

High-Speed Inspection

Performs rapid inspection without compromising measurement accuracy.

Real-Time Process Monitoring

Provides continuous feedback to optimize solder paste printing performance.

SMT Line Integration

Seamlessly integrates with SMT production equipment for automated inspection.

Industries we serve

Our Solder Paste Inspection (SPI) solutions help manufacturers achieve consistent solder paste quality and reliable SMT production across a wide range of industries. By detecting printing defects before component placement, SPI systems improve first-pass yield, reduce rework, and ensure superior PCB assembly quality.

Consumer Electronics

Automotive Electronics

Medical Devices

Industrial Electronics

Telecommunications

EMS production