VCTA SPI

VCTA Inline 3D SPI – High-Precision Solder Paste Inspection System

The VCTA Inline 3D SPI is an advanced solder paste inspection system designed to deliver accurate and reliable inspection of PCB solder paste deposits. Equipped with a high-speed industrial camera, a large-depth-of-field telecentric lens, and a digital grating system, it captures detailed 2D and 3D true-colour images to support precise inspection and consistent quality control.

Featuring a high-precision servo-driven motion platform, intelligent programming software, and advanced phase measurement profilometry (PMP), the system enables detailed analysis of solder paste height, shape, volume, and position. Its user-friendly interface supports automatic PAD data generation from CAD and Gerber files, while the detailed SPC analysis system helps monitor inspection results, identify process variations, and improve overall SMT production quality.

PRODUCT DETAILS

Technical Specifications

Advanced 3D solder paste inspection technology engineered for precision, stability and reliable PCB quality control.

Inspection System Inline 3D Solder Paste Inspection (SPI)
Motion Platform Servo Motor with High-Precision Ball Screw Structure
Motion Precision Up to 1 μm
Camera High-Frame-Rate Industrial Camera
Lens Large Depth-of-Field (DOF) Telecentric Lens
Lighting System Proprietary RGB Lighting System
Grating System Digital Grating System with Software-Controlled Motion
Measurement Technology Phase Measuring Profilometry (PMP)
Grayscale Resolution 8-bit
Detection Resolution Up to 0.37 μm
Image Output 2D and 3D True-Colour Images
Processing Technology GPU Parallel Processing
Programming Input CAD (DXF) and Gerber (RS274-D / RS274-X) Files
Statistical Analysis SPC Analysis with HTML, Excel and Image Report Output
Functional Modules Red Glue Inspection, Bare Board Program, Automatic Warp Compensation, Camera Barcode Recognition, Offline Programming and Debugging, Virtual Mark
ADVANCED INSPECTION TECHNOLOGY

Key Features

Intelligent inspection features designed to improve measurement accuracy, simplify programming and enhance production quality.

High-Precision Control Platform

Servo motor and high-precision ball screw technology deliver stable, vibration-free movement with positioning precision up to 1 μm.

High-Speed Camera System

A high-frame-rate industrial camera combined with a large DOF telecentric lens captures detailed images and handles PCB warpage effectively.

Digital Grating System

Software-controlled grating movement eliminates the need for traditional piezoelectric motors, reducing mechanical wear and maintenance requirements.

User-Friendly Programming Interface

Automatically generates PAD information from CAD and Gerber files, simplifying programming through straightforward inspection parameter settings.

True-Colour 3D Imaging

Phase Measuring Profilometry reconstructs precise surface contours and volume information to display detailed 3D images in true colour.

GPU Parallel Processing

Advanced GPU parallel processing technology accelerates image calculations and defect detection for efficient inspection performance.

Versatile Functional Modules

Supports red glue inspection, bare board programming, automatic warp compensation, barcode recognition and offline programming.

Detailed SPC Analysis

Monitors inspection feedback and process variations through statistical reports, charts and data exports in HTML, Excel and image formats.

Industries we serve

Our Automated Optical Inspection (AOI) solutions support a wide range of electronics manufacturing industries by delivering intelligent defect detection, enhanced quality assurance, and reliable inspection throughout the SMT production process.

Consumer Electronics

Automotive Electronics

Medical Devices

Industrial Electronics

Telecommunications

EMS production