Yamaha ysp
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Yamaha YSP – High-Speed, High-Precision Solder Paste Printer
Technical Specifications
| Model | Yamaha YSP |
|---|---|
| Machine Type | High-Speed High-Precision Printer |
| Applicable PCB Size | 50 × 50 mm (Min) to 510 × 460 mm (Max) |
| PCB Thickness | 0.4–3.0 mm |
| Printing Head | 3S Head (Swing Single Squeegee) |
| Squeegee Speed | 2–200 mm/sec |
| Squeegee Pressing Force | 5–200 N ± 2 N (Feedback Control) |
| Squeegee Printing Attack Angle | 45°–65° (Variable Control) |
| Squeegee Material | Metal or Urethane |
| Wet Print Accuracy (6σ) | ±25 μm |
| Positioning Repeatability (6σ) | ±12.5 μm |
| Printing Line Tact | 9.5 sec/cycle (Under Optimum Conditions) |
| Applicable Stencil Sizes | 750 × 750 mm, 736 × 736 mm, 750 × 650 mm, 650 × 550 mm, 600 × 550 mm, 550 × 650 mm |
| Power Supply | 3-Phase AC 200/208/220/240/380/400/416 V ±10%, 50/60 Hz |
| Air Supply | 0.45 MPa or More (Clean and Dry Air) |
| External Dimensions |
1640 × 1640 × 1400 mm (Normal Conveyor) 1973 × 1640 × 1400 mm (Exit Extension Conveyor) |
| Machine Weight | Approx. 1500 kg |
Key Features
High-Speed 3S Printing Head
Yamaha's original 3S head automatically adjusts squeegee angle and speed to optimize printing performance for different solder paste types and volumes.
High-Precision Printing
With wet print accuracy of ±25 μm and positioning repeatability of ±12.5 μm (6σ), the YSP delivers accurate and consistent solder paste deposition.
Vacuum Stencil Lock
Vacuum locking stabilizes the stencil during printing, reducing movement and preventing Y-directional print offsets for improved accuracy.
Triple Track Transport System
The three-stage track system supports high-speed PCB transfer, while self-adjusting board clamps ensure secure positioning during printing.
Automatic Cleaning System
The automatic cleaning system adjusts cleaning mode, speed, and suction according to working conditions to maintain consistent printing quality.
Graphical Board Alignment
The graphical layer-based alignment function superimposes PCB and stencil images, allowing operators to check and adjust printing positions easily.
Print Stability Control (PSC)
The PSC system automatically supplies solder paste to maintain consistent rolling paste width on the stencil and stabilize printing quality.
Filling Adjustment Function
Automatically adjusts squeegee angle and speed to improve stencil aperture filling, helping maintain consistent paste deposition after cleaning or process pauses.
