Reflow Oven T-960

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Efficient LED Reflow Soldering with Precise Temperature Control

The T-960 Reflow Oven is designed for reliable PCB reflow soldering, featuring 3 upper and 2 lower heating zones with a total heating-zone length of 960 mm. It uses intelligent-level sirocco and infrared heating technology along with a single cooling zone to provide controlled and consistent soldering performance. The oven supports PCB boards up to 300 mm wide and operates from left to right.

The T-960 incorporates PID closed-loop temperature control with a temperature range from room temperature up to 300°C, achieving temperature control accuracy of ±1°C and PCB temperature distribution deviation of ±2°C. With a peak power of 4.5 kW, approximately 15-minute heating-up time, and net/chain transmission options, it provides a practical solution for consistent and efficient PCB soldering.

TECHNICAL SPECIFICATIONS

T-960 Reflow Oven Specifications

Key specifications of the T-960 reflow oven, covering its heating zones, cooling system, PCB handling, temperature control, power requirements, dimensions, and machine weight.

Machine Model T-960
Heating Zone Quantity Upper 3 / Down 2
Length of Heating Zone 960 mm
Heating Type Intelligent Level Sirocco and Infrared Heating
Cooling Zone Quantity 1
Maximum Width of PCB Board 300 mm
Operation Direction Left → Right
Delivery Options Net Transmission + Chain Transmission
Conveyor Belt Speed 0 – 1600 mm/min
Power Supply Three Phase 5 Line, 380 V, 50/60 Hz
Peak Power 4.5 kW
Heating-Up Time Approximately 15 minutes
Temperature Control Range Room Temperature – 300°C
Temperature Control Mode PID Closed-Loop Control
Temperature Control Accuracy ±1°C
PCB Temperature Distribution Deviation ±2°C
Overall Dimensions 1450 × 630 × 470 mm
Machine Weight 160 kg

Industries we serve

Consumer Electronics

Automotive Electronics

Industrial Electronics

EMS Manufacturing

Medical Electronics

R&D & Prototype Production