Magic ray AOI

Magic-ray V5000 Series Automated Optical Inspection for High-Precision PCB Inspection

The Magic-ray V5000 Series Automated Optical Inspection (AOI) is designed for high-precision, high-speed inline inspection of PCBs in both pre-reflow and post-reflow stages. Its granite platform, telecentric lens, powerful inspection algorithms, and automatic compensation for PCB warpage help deliver reliable inspection performance while supporting SPC data analysis for improved process quality.

The system provides advanced inspection capabilities including intelligent solder-pad positioning, poor soldering detection, IPC-standard parameter calculation, and FOV-assisted positioning. It can identify defects such as missing or wrong components, polarity errors, shift, reverse placement, solder defects, lifted leads, tombstones, solder bridges, solder balls, and other assembly issues, making it suitable for comprehensive SMT production-line inspection.

Technical Specifications

Magic-ray V5000 Series AOI Technical Specifications

Detailed specifications of the V5000 Series Automated Optical Inspection systems for high-precision PCB inspection.

Equipment Model V5000 V5000D V5000XL V5000DL
Image System Camera
5MP / 12MP Industrial Camera
5MP Camera: 15μm, 10μm / 12MP Camera: 15μm, 12μm, 10μm, 6.3μm
37 × 30 mm (5MP, 15μm); 60 × 45 mm (12MP, 15μm)
Telecentric Lens
Lighting 4-Color Ring Shape LED (RGBW)
Movement Structure X/Y Movement X/Y Movement
AC Servo AC Servo (Dual Drive)
Platform
Granite
Width Adjustment
Automatic
Transport Type Belt
Board Loading Direction Left to Right or Right to Left (Select at Point of Order)
Fixed Rail Single Lane: 1st Fixed Rail; Dual Lane: 1st Rail and 2nd Rail or 1st & 4th Fixed Rail
Hardware Configuration Operating System
Windows 10
Communication
Ethernet, SMEMA
Power Requirement
Single Phase 220V, 50/60Hz, 5A
Air Requirement 0.4–0.6 MPa
Conveyor Height 900 ± 20 mm
Equipment Dimensions L935 × D1360 × H1570 mm
(Without Tower Light) 		L1125 × D1360 × H1570 mm
(Without Tower Light)
Equipment Weight 900 kg 950 kg 1100 kg 1150 kg
PCB Size Size
50 × 60 – 510 × 610 mm Dual Lane: 50 × 60 – 510 × 320 mm

Single Lane: 50 × 60 – 510 × 580 mm 		50 × 80 – 675 × 610 mm Dual Lane: 50 × 80 – 675 × 320 mm

Single Lane: 50 × 80 – 675 × 560 mm
Thickness
0.6–6.0 mm
PCB Weight
≤3 kg
Component Clearance Top Clearance 25–60 mm Adjustable, Bottom Clearance 45 mm
Clamping Edge 3.0 mm
Inspection Functions Component
Wrong Component, Missing, Polarity, Shift, Reverse, Damage, IC Lead Bend, Foreign Material, Tombstone, etc.
Solder Joint
No Solder, Insufficient Solder, Open Solder, Excess Solder, Solder Bridge, Solder Ball, etc.
Component Size Chip: 03015 and Above; LSI: 0.3 mm Pitch and Above; Others: Odd Shape Component
Inspection Speed 180–200 ms / FOV

Industries we serve

Our Automated Optical Inspection (AOI) solutions support a wide range of electronics manufacturing industries by delivering intelligent defect detection, enhanced quality assurance, and reliable inspection throughout the SMT production process.

Consumer Electronics

Automotive Electronics

Medical Devices

Industrial Electronics

Telecommunications

EMS production