Semi-Automatic Printer 1.2m
TECHNICAL SPECIFICATIONS
1.2m Semi-Automatic Printer Specifications
Technical specifications of the 1.2m semi-automatic solder paste printing machine for accurate and consistent PCB printing.
| Device Model | HZT-1200 |
|---|---|
| Printing Table Area | 1300 × 320 mm |
| Substrate Size | 1400 × 320 mm |
| Machine Size | 1500 × 900 × 1680 mm |
| Substrate Thickness | 0.2 – 3 mm |
| Fixed Printing Position | 950 mm high |
| Platen Fine-Tuning | R/L ±10 mm |
| Printing Accuracy | ±0.02 mm |
| Machine Repeatability | ±0.03 mm |
| Minimum Spacing | 0.35 mm |
| Compressed Air | 4 – 7 Kgf/cm² |
| Power Supply | 220V, 50/60Hz, 100W |
| Machine Weight | 280 kg |
KEY FEATURES
1.2m Semi-Automatic Printer Features
Designed for precise stencil positioning, flexible adjustment and convenient operation in SMT PCB printing applications.
Accurate Positioning
Servo positioning supports accurate positioning during the solder paste printing process.
Fine-Tuning Adjustment
X, Y and Z calibration allows convenient and precise adjustment of the PCB and stencil.
Adjustable Scraper
Scraper position and angle can be adjusted according to different printing requirements.
PLC Touch Control
PLC and touchscreen interface provide simple and convenient machine operation.
Large Printing Table
The 1300 × 320 mm printing table provides a larger working area for PCB printing.
Automatic Counting
Automatic counting helps monitor and track production output efficiently.
