US Series Lead-free Wave Soldering System
Equipped with a dual-axis X/Y stepping motor nozzle, this system delivers precise, programmable fluxing capable of handling complex selective secondary and continuous spraying patterns. Its modular 3-stage preheating design allows seamless mixing of hot air and infrared heating to optimize thermal activation for diverse board profiles, while an innovative conveyor structure supports heavy board payloads up to 60 kg with ultra-stable transport speeds.
The redesigned tin pot and crest nozzle feature adjustable wave drop control, significantly minimizing dross formation to reduce material waste and maintenance downtime. Complemented by flexible dual-sided upper and lower air cooling, the US Series provides tight thermal management to lock in robust solder joints and maximize throughput for high-reliability, lead-free SMT manufacturing.
Technical Specifications
US-350 Technical Specifications
Comprehensive technical specifications of the US-350 Lead-Free Wave Soldering System for efficient and reliable PCB assembly.
| Model | US-350 |
|---|---|
| Dimensions (L×W×H) | 4350 × 1600 × 1730 mm |
| Power Supply |
3P5W 380V AC 50/60Hz 100A Optional: 3P5W 220V AC 50/60Hz 150A |
| Power Consumption |
Total Power: 45 KW (+6 KW per additional preheat module) Power Demand: 80 KW | Operating Power: ≤9 KW |
| Control System | PC + PLC Control System |
| Preheating System |
Hot Air / IR Mode | 3 Preheat Zones (1800 mm length) Optional: Upper Preheating (Up to 3 pcs) / 2480 mm 4-Preheat Option | Temp: RT–250°C |
| Solder Pot Capacity & Temp |
Capacity: ~480 KG (Lead-Free) | Heating Power: 14.5 KW Max Temp: 300°C | Control Method: PID + SSR |
| Wave Drive & Warm-up Time |
1/4 HP × 2 (3P 220V AC) Warm-up Time: Approx. 180 min (Set: 250°C) |
| PCB Width & Transmission Speed | 50–350 mm | 300–1800 mm/min |
| Component Clearance & Rail Inclination |
Top 90 mm / Bottom 25 mm Rail Inclination: 5.5°±0.2° (Adjustable 4°–7°) |
| Fluxing System | Corrosion-resistant air-operated diaphragm pump | Spray Flow: 20–100 ml/min |
| Nitrogen System (Optional) | Consumption: 25 m³/h (Below 1000 PPM) | Pressure: 0.5–0.8 MPa |
Key Features
Advanced Features of US-350 Wave Soldering
High-efficiency lead-free wave soldering delivering modular preheating, flexible flux control, and robust board handling.
PC + PLC Smart Control
Centralized PC and PLC control interface ensuring intuitive process setup, data tracking, and stable long-term operation.
Modular 3-Stage Preheating
1800 mm preheat tunnel supporting Hot Air and IR modules with optional top-side preheating for optimal flux activation.
Auto Diaphragm Flux Spraying
Corrosion-resistant air-operated pump maintaining precise spray flow rates between 20–100 ml/min.
Adjustable Rail Inclination
Flexible conveyor guide rail angle adjustment (4° to 7°) to match specific board densities and minimize bridging.
Optional Nitrogen Environment
Supports low-oxygen N₂ inerting (under 1000 PPM at 25 m³/h) to significantly lower dross and improve solder wetting.
Optional 2HP Air Cooling
Compatible with an optional 2HP air cooler unit to accelerate thermal drop and stabilize solder joint formation.
