PERSCI Inline Automated Optical Inspection (AOI) System

The PERSCI Inline AOI System is a high-speed automated optical inspection solution designed for real-time defect detection in SMT production lines. It integrates seamlessly with Surface Mount Technology (SMT) and Through-Hole (THT) assembly processes, ensuring continuous monitoring and high-precision quality control. Equipped with AI-powered image processing, high-resolution cameras, and advanced lighting systems, this inline AOI system rapidly identifies soldering defects, missing components, polarity errors, and misalignments, reducing manual inspection efforts and improving overall production efficiency.

PERSCI Offline Automated Optical Inspection (AOI) System

Product Features

  • High-Speed Inline Inspection – Designed for real-time PCB scanning without slowing down production.
  • AI-Powered Defect Recognition – Uses deep-learning algorithms to detect solder joint issues, component misplacements, and missing parts.
  • Multi-Camera Vision System – Equipped with high-resolution cameras to capture defects with ±10μm precision.
  • 3D & 2D AOI Capabilities – Provides accurate height measurement for co-planarity checks and solder joint analysis.
  • Multi-Spectrum LED Illumination – Ensures optimal contrast for enhanced defect detection.
  • Fully Automated Operation – Works in sync with the SMT production line, eliminating the need for manual intervention.
  • Smart Data Analysis & Reporting – Generates real-time inspection reports, enabling quick corrective actions.
  • User-Friendly Interface – Features an intuitive touchscreen GUI for easy programming and parameter adjustments.

Product Applications

  • High-Volume PCB Manufacturing.
  • SMT and THT Component Assembly Inspection.
  • Consumer Electronics, Automotive, Aerospace, and Medical Device Manufacturing.
  • Real-Time Defect Prevention in Production Lines.
  • Post-Soldering & Pre-Reflow Inspection.
  • Smart Factory Integration with MES Systems.

Technical Parameters

Applicable scenario Inspection after SMT reflux furnace
Detection algorithm TOC, Histogram, Match, Short, Other, PIN, etc.
Resolution / visual range / speed 300W pixels 500W pixels
Standard: 20um/Pixel FOV: 40mmx30mm Speed< 260ms/FOV Standard: 20um/Pixel FOV: 48mmx40mm Speed< 230ms/FOV
Standard: 25um/Pixel FOV: 50mmx38mm Speed< 270ms/FOV Standard: 25um/Pixel FOV: 60mmx50mm Speed< 250ms/FOV
Standard: 15um/Pixel FOV: 30mmx23mm Speed< 240ms/FOV Standard: 15um/Pixel FOV: 36mmx30mm Speed< 210ms/FOV
Standard: 15um/Pixel FOV: 20mmx15mm Speed< 210ms/FOV Standard: 10um/Pixel FOV: 24mmx20mm Speed< 160ms/FOV
Light Source High brightness rrgb coaxial ring tower LED light source (colour light)
Programming Manual writing, automatic frame, CAD data import, catalog retrieval, (optional: offline programming, remote programming)
Remote Control Through the TCP / IP network, remote operation, anytime and anywhere view, start, or stop the machine operation, modify the program and other operations can be realized
Detection coverage type Sholder paste printing: bridging, deflection, No solder paste, less / more tin, foreign matters
Surface mounting : bridging, wrong parts, missing parts, polarity, deviation, stele erection, damage, IC bending feet, foreign matters.
After reflow welding: wrong parts, missing parts, polarity, deviation, stele erection, reversal, damage, IC bending feet, foreign matters, NO solder paste, less/more tin, bridging, false welding, solder ball
After wave soldering: inserting needle. No solder paste, less / more tin, hole, false soldering, solder ball
Special function It supports automatic calling program, multi board multi program detection function, positive and negative program detection function; it can check 0-359 rotating parts (unit: 1 )
Minimum element 10um; 01005chip & 0.3 pitch IC
SPC and process Test Data is recorded and analyzed in the whole process. Production status and quality analysis can be viewed in any area, and excel, txt and other file formats can be output
Bar code system Automatic barcode recognition (1D or 2D code)
Server mode Adopt central server to manage several AOI data centrally
Other Windows7, 21.5” LCD, OK / NG singal
Model A3 A3-U
PCB Size range 50x50mm (min) ~ 430x330mm (max) 50x50mm (min) ~ 500x600mm (max)
PCB thickness range 0.3 to 5mm
Edge clearance of PCB clamping system TOP: 3.5mm Botton: 3.5mm
Maximum PCB weight 3KG
PCB curvature < 5mm or 2% of PCB diagonal length
PCB upper and lower clear height PCB top side: 30mm PCB bottom side 60mm PCB top side: 85mm PCB bottom side 30mm
Conveyor system Fixed bottom up, automatic compensation for PCB bending deformation. automatic in and out board automatic width adjustment of flat ble.
Conveyor height of ground 890 to 980mm.
conveyor flow direction Left to right or right to left can be set.
X / Y platform drive Screw rod and AC servo motor drive, PCB fixed, camera Moving in XY direction.
Power Supply AC230V 50/60Hz < 1.5KVA
Pressure 0.4-0.8Mpa
Equipment weight About 700KG
Equipment Size 925x1165x1500mm (L x W x H) excluding signal lamp height
Ambient temperature and humidity 10-35 C 35-80% RH (no condensation)
Equipment safety regulations Comply with CE safety standards, Send data file to repair station (option)