HOT PLATE

The Hot Plate is a precision heating device designed for preheating, soldering, and reflow applications in electronics manufacturing. It provides uniform and controlled heating, making it ideal for SMD rework, PCB assembly, and component testing. With adjustable temperature settings and a robust heating surface, the hot plate ensures efficient heat transfer without damaging sensitive electronic components.

This machine is widely used for manual soldering, rework processes, drying, and curing applications in various industries, ensuring high-quality results with consistent thermal performance.

HOT PLATE

Product Features

  • Precise Temperature Control – Adjustable temperature settings for accurate and stable heating.
  • Even Heat Distribution – Ensures uniform heating across the entire surface.
  • Fast Heating Response – Quickly reaches the set temperature, enhancing productivity.
  • Durable Construction – Made with high-quality aluminum or stainless steel for longevity.
  • User-Friendly Interface – Digital or analog controls for easy operation.
  • Safe Operation – Overheat protection and insulated surface to prevent burns and damage.
  • Compact and Portable – Lightweight design for workbench applications and mobility.

Product Applications

  • PCB Assembly & SMD Rework – Ideal for preheating circuit boards and soldering components.
  • Reflow Soldering – Assists in solder paste reflow for small batch production.
  • Electronics Repair – Used in BGA rework and component removal processes.
  • Adhesive & Epoxy Curing – Helps in drying and hardening adhesives in industrial applications.
  • Research & Development – Used in electronics labs for material testing and temperature experiments.