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Fully Automatic Printer

The Fully Automatic Printer is a high-speed, precision printing solution designed for modern Surface Mount Technology (SMT) production lines. Engineered for efficiency and accuracy, this advanced machine automates the entire printing process, from stencil alignment to solder paste deposition, ensuring consistent and high-quality results. With intelligent control systems, automatic vision alignment, and real-time monitoring, it significantly reduces manual intervention and enhances production throughput. Ideal for large-scale PCB manufacturing, the Fully Automatic Printer is a must-have for companies seeking to optimize productivity and quality in electronics assembly.

Fully Automatic Printer

Product Features

  • Fully Automated Operation – Eliminates manual handling, improving efficiency and precision.
  • High-Speed Printing – Ensures rapid processing for high-volume production lines.
  • Automatic Optical Alignment System – Uses advanced vision technology to precisely align stencils and PCBs.
  • Intelligent Squeegee Control – Adjusts pressure, speed, and angle for optimal solder paste application.
  • Real-Time Monitoring & Feedback – Detects and corrects printing defects to minimize errors.
  • Auto Stencil Cleaning System – Enhances consistency by automatically cleaning the stencil during operation.
  • User-Friendly Touchscreen Interface – Intuitive controls for easy operation and parameter adjustment.
  • Robust & Durable Design – Built with high-quality materials for long-term stability and reliability.

Product Applications

  • High-Volume PCB Assembly – Ideal for mass production in consumer electronics, telecommunications, and automotive industries.
  • Automotive Electronics – Ensures precision printing for safety-critical vehicle electronics.
  • Medical Device Manufacturing – Supports high-reliability PCB production for healthcare applications.
  • Aerospace & Defense Electronics – Used for mission-critical circuit board manufacturing.
  • Industrial Equipment & IoT Devices – Ensures high-precision assembly for smart devices and industrial automation.

Technical Parameters

PCB & PCB PARAMETER
Maximum Board Size( X x Y ) 450mm x 350mm
Minimum Board Size ( X x Y ) 50mm x 50mm
PCB thickness 0.4mm ~ 6mm
Warpage ≤1%Diagonal
Maximum board weight 6kg
Board margin gap 3mm Configuration to 3mm
Maximum bottom clearance 20mm
Transport speed 1500mm/s(Max)
Transport height from the ground 900±40mm
Transport direction L-R, R-L, L-L, R-R
Transport mode One stage conveyor
PCB clamping system Software adjustable (Option:Partial Vacuum Cavity / Whole Vacuum Cavity/PCB Edge)
Support System Magnetic Pin/Support Blocks, etc.
PRINTING PARAMETER
Printing Head Linear motor D, sed loop printing head
Stencil size 370mm x 470mm - 737mm x 737mm
Maximum printing area (X x Y) 450mm x 350mm
Squeegee type Steel / rubber Squeegee (Angle 45 x5 x60 Matching the printing process)
Squeegee length 220mm-500mm
Squeegee height 65±1mm
Squeegee thickness 0.25mm diamond-like carbon Coating
Printing mode Single or double printing
Demoulding length 0.02mm - 12mm
Printing speed 0 ~ 200 mm/s
Printing pressure 0.5kg - 10kg
Printing stroke ±200 mm (From the center)
IMAGE PARAMETER
Field of view 8mm x 6mm
Platform adjustment range X,Y:±7.0mm,θ:±2.0°
Mark type Standard shape benchmark point (SMEMA standard), solder pad/openings
Camera system Independent camera, upwards/downwards imaging vision system, geometric matching location
PERFORMANCE PARAMETER
Repeat position accuracy ±10.0μm @6 σ, Cpk ≥ 2.0
Repetition accuracy ±25.0μm @6 σ, Cpk ≥ 2.0
Cycle time < 7s
Product change over < 5min
EQUIPMENT
Power requirements AC220V±10%,50/60HZ, 15A
Compressed air requirements AC220V±10%,50/60HZ, 15A
Operating system Win 7
External dimension 1140mm(L) x 1415mm (W) x 1480mm (H) (Without light, monitor and keyboard)
Machine weight 1000kg Appro. 1000kg
TEMPERATURE AND HUMIDITY CONTROL MODULE (OPTIONAL)
Environment Temperature 23±3°C
Relative humidity 45~70%RH4