3D Automated Optical Inspection (3D-AOI) System
The 3D-AOI System is a high-precision automated optical inspection solution designed to detect surface-mounted (SMT) and through-hole (THT) defects with exceptional accuracy. Unlike traditional 2D AOI, this system utilizes advanced 3D imaging technology to analyze component height, shape, and solder volume, ensuring a comprehensive and reliable quality control process. Equipped with AI-driven defect detection and deep-learning algorithms, the 3D-AOI system significantly reduces false calls and enhances production efficiency. It is an essential tool for electronics manufacturers seeking to maintain zero-defect production and improve overall yield.
Product Features
- True 3D Inspection – Uses multiple projection angles to capture accurate height and shape measurements.
- Ultra-High-Resolution Cameras – Provides detailed image analysis for detecting micro defects.
- Advanced AI Algorithms – Reduces false calls and improves detection accuracy.
- Automated Solder Joint Analysis – Detects insufficient solder, tombstoning, and lifted leads.
- Multi-Spectrum LED Lighting – Enhances image contrast for precise defect identification.
- Fast & Accurate Inspection – Optimized for high-speed production lines with rapid image processing.
- Intelligent Defect Classification – Categorizes defects for quick troubleshooting and process optimization.
Product Applications
- SMT and THT inspection in PCB assembly lines
- Pre-reflow and post-reflow solder joint inspection
- Quality control for automotive, aerospace, medical, and consumer electronics manufacturing.
- BGA, QFN, and fine-pitch component inspection.
- Production environments requiring Industry 4.0 and AI-driven defect analysis.